Our Users

“We tested processing units and microcontrollers for the Nyx capsule. In terms of how they benefit our activities, I would say that qualifying these devices was crucial in confirming the defined avionics architecture. The beam type you need to pick depends on the radiation requirements that must be complied with and then the package complexity whether it is convenient to use high energy over low energy.

Flip-chip devices have a very small form factor, so it is easy to build very high-throughput computing systems in a small board with them and save mass and space. To test flip-chips it is ideal to have a few mm penetration because sometimes the package is 0.5 mm of copper and other times you just have chips stacked on top of each other inside the package that you can’t really test anywhere else because you can’t thin them down.

Given the number of flip-chips used in our designs, we have been actively seeking any possible opportunity to test with high-energy ions.”